EH15 Series Recommended Solder Reflow Methods

Note: Temperatures shown are applied to body of device.

TS MAX to TL (Ramp-up Rate)	5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)	N/A
- Temperature Typical (TS TYP)	150°C
- Temperature Maximum (TS MAX)	N/A
- Time (tS)	60 - 120 Seconds
Ramp-up Rate (TL to TP)	5°C/second Maximum
Time Maintained Above:
- Temperature (TL)	150°C
- Time (tL)	200 Seconds Maximum
Peak Temperature (TP)	240°C Maximum
Target Peak Temperature (TP Target)	240°C Maximum 2 Times / 230°C Maximum 1 Time
Time within 5°C of actual peak (tP)	10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
Ramp-down Rate	5°C/second Maximum
Time 25°C to Peak Temperature (t)	N/A
Moisture Sensitivity Level	Level 1

Note: Temperatures listed are applied to body of device.

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

Note: Temperatures listed are applied to body of device.

185°C Maximum for 10 seconds Maximum, 2 times Maximum.