EP25 Series Recommended Solder Reflow Methods

Solder Reflow Profile

Solder Reflow Profile
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High Temperature Infrared/Convection

Note: Temperatures shown are applied to body of device.

TS MAX to TL (Ramp-up Rate) 3°C/second Maximum
Preheat  
 - Temperature Minimum (TS MIN) 150°C
 - Temperature Typical (TS TYP) 175°C
 - Temperature Maximum (TS MAX) 200°C
 - Time (tS) 60 - 180 Seconds
Ramp-up Rate (TL to TP) 3°C/second Maximum
Time Maintained Above:  
 - Temperature (TL) 217°C
 - Time (tL) 60 - 150 Seconds
Peak Temperature (TP) 260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tP) 20 - 40 seconds
Ramp-down Rate 6°C/second Maximum
Time 25°C to Peak Temperature (t) 8 minutes Maximum
Moisture Sensitivity Level Level 1
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Low Temperature Infrared/Convection

Note: Temperatures shown are applied to body of device.

TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat  
 - Temperature Minimum (TS MIN) N/A
 - Temperature Typical (TS TYP) 150°C
 - Temperature Maximum (TS MAX) N/A
 - Time (tS) 60 - 120 Seconds
Ramp-up Rate (TL to TP) 5°C/second Maximum
Time Maintained Above:  
 - Temperature (TL) 150°C
 - Time (tL) 200 Seconds Maximum
Peak Temperature (TP) 240°C Maximum
Target Peak Temperature (TP Target) 240°C Maximum 2 Times / 230°C Maximum 1 Time
Time within 5°C of actual peak (tP) 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
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High Temperature Manual Soldering

Note: Temperatures listed are applied to body of device.

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

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Low Temperature Manual Soldering

Note: Temperatures listed are applied to body of device.

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

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Category
Oscillator
Series
EP25
Package
Ceramic
Voltage
5.0V
Class
OS48
Revision
F 07-17-2008
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