Ecliptek RoHS Compliance (Pb-Free) Roadmap

RoHS (Pb-Free) Overview
In December 2002, the European Union Parliament approved the content of two directives to better control the management of waste electronic equipment. The two directives are the Waste from Electrical and Electronic Equipment (WEEE) and the Restriction of Hazardous substances (RoHS). The WEEE addresses the collection and treatment requirements of waste electronic equipment for the member countries. The RoHS sets phase-out dates for the use of Lead (Pb) and several other materials contained in electronic products. The RoHS states that the targeted materials shall no longer be contained in the electronic products above certain limits unless there is an exemption provided in the rule.

Ecliptek RoHS (Pb-free) Program
The Ecliptek RoHS Compliance (Pb-free) program is implemented in accordance with European Union (EU) Legislation titled "Restriction of the use of certain Hazardous Substances (RoHS)" including banning the use of Lead (Pb) in electronic assemblies after July 1, 2006. The RoHS Compliance Matrix below provides a listing of the RoHS and Pb-free classifications for all Ecliptek components and assemblies.

Ecliptek Definitions

• RoHS Compliance Classification: Component and Assembly shall be compliant to Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. These substances include Lead (Pb), mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE).
  
• RoHS Compliance Exemptions: Article 4, paragraph 1 of the RoHS directive references the restriction of the use of certain hazardous substances. Paragraph 2 of the directive references exemptions to these substances. Those exemptions applicable to Ecliptek product are referenced in the paragraphs 6 and 7 in the ANNEX Section as follows:
  
  6. Lead (Pb) as an alloying element in steel containing up to 0.35% Lead (Pb) by weight, aluminum containing up to 0.4 % Lead (Pb) by weight and as a copper alloy containing up to 4% Lead (Pb) by weight.
  7. Lead (Pb) in high melting temperature type solders (i.e. Lead-based solder alloys containing more than 85% Lead).
     
• Pb-Free Classification: Component and Assembly Lead (Pb) content shall be less than 0.1% by weight of the device (in accordance to IPC/EIA J-STD-006), shall not be intentionally introduced, and shall be a homogeneous material that can not be mechanically disjoined into different materials.
  
• Components: Ecliptek's definition of components apply to quartz crystal devices
  
• Assemblies: Ecliptek's definition of assemblies apply to oscillator devices (MEMS Oscillators, XO, VCXO, TCXO, and OCXO's)

Solder Composition
Ecliptek has qualified the following Pb-free solder composition recommended by the North American Electronics Manufacturing Initiative (NEMI) and IPC's Solder Product Value Council (SPVC): Sn95.5Ag3.9Cu0.6 and Sn96.5Ag3.0Cu0.5, respectively, for attachment of Ecliptek components and assemblies to the printed circuit board.

Part Number Identification
When applicable, the Ecliptek specification sheet shall indicate if the device is classified as RoHS Compliant or RoHS Compliant (Pb-free).

Process Compatibility
The Ecliptek specification sheet identifies the suggested solder reflow profile(s). All Ecliptek RoHS Compliant and RoHS Compliant (Pb-free) products are backwards compatible to lower temperature Tin-Lead (SnPb) reflow profile(s).

Marking and Labeling
Ecliptek has a Pb-free labeling method for the packaging of all RoHS Compliant and RoHS Compliant (Pb-free) products. The lowest level shipping container shall identify the products as Pb-free.

RoHS Compliant and RoHS Compliant (Pb-Free) 260°C Solder Reflow Profile
Ecliptek RoHS Compliant and RoHS Compliant (Pb-Free) products shall be capable of withstanding the following solder reflow profile:

• SMD Components and Assemblies Reflow Methods
  • Infrared/Convection Reflow (per IPC/JEDEC J-STD-020)
    • Average ramp-up rate of 3°C/second maximum
    • Pre-heat from 150°C to 200°C, 60 to 180 seconds
    • Time maintained above a reflow temperature of 217°C, 60 to 150 seconds
    • Target Peak Temperature of 250°C +0/-5°C, 20 to 40 seconds
    • Peak Temperature of 260°C maximum for 10 seconds maximum
    • Average ramp-down rate of 6°C/second maximum
    • Time from 25°C to Peak Temperature, 8 minutes maximum(One time)
  • Manual Solder Reflow
    • Target Peak Temperature of 250°C +0/-5°C, 5 to 10 seconds
    • Peak Temperature of 260°C maximum for 10 seconds maximum
• Through-hole Components and Assemblies Reflow Methods
  • Wave Solder (Back of board Solder Bath Reflow)
    • Pre-heat from 150°C to 200°C, 60 to 180 seconds
    • Peak Temperature of 260°C maximum for 10 seconds maximum (one time)
  • Manual Solder Reflow
    • Target Peak Temperature of 250°C +0/-5°C, 5 to 10 seconds
    • Peak Temperature of 260°C maximum for 10 seconds maximum

For additional information about the Ecliptek Corporation RoHS Compliance (Pb-free) Program, please read our frequently asked questions (FAQ's).

Crystals

Oscillators